AMAT CMP Reflexion provides comprehensive and high-performing planarization solutions. It allows for high-speed planarizing platens and multi-zone polishing heads enabling superior uniformity and efficiency with low downforce.

Designed with the latest drying technology that thoroughly removes watermark defects and particle contamination.

• Supported Applications: Production-proven planarization platform optimized for stable copper, tungsten, and oxide Chemical Mechanical Planarization (CMP).

• Operational Reliability: Calibrated to ensure highly consistent wafer-to-wafer uniformity, precise downforce control, and excellent endpoint detection accuracy.

• Consumables & Parts Ecosystem: Direct replacements for retaining rings, polishing heads, slurry delivery valves, and conditioning disks to support continuous operation.